Actuation mechanisms for electrical interconnections

ABSTRACT

Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include an electronic arrangement, a first die, and a second die coupled to the first die and the electronic arrangement. The electronic arrangement may include an opening. At least a portion of the die may occupy at least a portion of the opening in the electronic arrangement. Other embodiments including additional apparatuses and methods are described.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. Patent Application Ser. No.13/707,032, filed Dec. 6, 2012, which is incorporated by referenceherein in its entirety.

TECHNICAL FIELD

Embodiments described herein pertain to electrical devices. Someembodiments relate to electrical interconnections involving integratedcircuit packages and circuit boards.

BACKGROUND

Many electronic items including desktop, laptop, and tablet computers,cellular phones, and other electronic items, usually have one or moreelectrical devices, such as a memory device to store information, aprocessor to process information, or both the memory device and theprocessor. The device may be part of an integrated circuit (IC) package.Information exchanged between the device of the IC package and otherdevices may be conducted in the form of electrical signals passingthrough electrical connections between the IC package and the otherdevices. The electrical connections may be formed in part by conductiveconnections (e.g., solder balls) located on the IC package andinterconnections located on a circuit board. In some cases, suchelectrical connections may be temporarily formed for testing the deviceduring a test. Factors such as package warpage and manufacturingtolerances may degrade such electrical connections. Designing electricalinterconnections to account for such factors may sometimes pose achallenge.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a block diagram of an electronic arrangement includinginterconnections for providing electrical connections between anelectronic assembly and a base, according to some embodiments describedherein.

FIG. 2A, FIG. 2B, FIG. 2C, and FIG. 2D show different views ofinterconnections including a crank-shaped spring, according to someembodiments described herein.

FIG. 3A, FIG. 3B, FIG. 3C, and FIG. 3D show different views ofinterconnections including a rod and a spring, according to someembodiments described herein.

FIG. 4A, FIG. 4B, FIG. 4C, and FIG. 4D show different views ofinterconnections including a volute spring, according to someembodiments described herein.

DETAILED DESCRIPTION

FIG. 1 shows a block diagram of an electronic arrangement 100 includinginterconnections 110 for providing electrical connections between anelectronic assembly 120 and a base 130. according to some embodimentsdescribed herein. Base 130 may include a circuit board (e.g., a printedcircuit board, such as a motherboard). Electronic assembly 120 mayinclude an integrated circuit (IC) package or other electronic devices.Electronic assembly 120 may include conductive contacts (e.g., solderballs) 121 to be coupled to respective interconnections 110.

Electronic assembly 120 may include a device 122 attached to a substrate(e.g., a package substrate) 123 through conductive contacts (e.g.,solder balls) 124. Substrate 123 may include conductive paths (notshown) coupled to conductive contacts 121 and 124. Device 122 mayinclude a semiconductor (e.g., silicon) die. The die may includecircuitry to perform one or more functions, such as processinginformation, storing information, or other functions. For example, thedie in device 122 may include a processor (e.g., including transistors,arithmetic logic units, and other components) that may include a centralprocessing unit (CPU), a graphics processing unit (GPU), or both. Theprocessor may also include application specific integrated circuits(ASIC).

Examples of the IC package in electronic assembly 120 may include a ballgrid array (BGA) packaging type, land grid array (LGA) packaging type,pin grid array (PGA) packaging type, or other types of packaging.Electronic assembly 120 may be included in electronic items such asdesktop, laptop, and tablet computers, e-readers (e.g., e-book readers),personal digital assistants (PDAs), cellular telephones, smart phones,servers, web appliances, set-top boxes (STBs), network routers, networkswitches, network bridges, or other types of electronic items.

As shown in FIG. 1, base 130 may be coupled to an analyzer 140 throughan interface 150. Interface 150 may include conductive paths (e.g.,electrical conductors) coupled to interconnections 110 to allowcommunication (e.g., in the form of signals) between analyzer 140 andelectronic assembly 120 through interconnections 110 and interface 150.Analyzer 140 may include a tester (e.g., a computer) to test electronicassembly 120 (e.g., to test device 122), base 130, or both. Thus, inelectronic arrangement 100, device 122 may be may be a device under test(DUT).

FIG. 1 shows only five interconnections 110 as an example. The number ofinterconnections 110 may vary. For example, electronic arrangement 100may include numerous interconnections 110 arranged in rows and columns.For simplicity, FIG. 1 show interconnections 110 located in only aportion (e.g., top portion) of base 130. Interconnections 110, however,may include components located in other portions (e.g., middle andbottom portions) of base 130. For example, interconnections 110 mayinclude interconnections having components described in more detailbelow with reference to FIG. 2A through FIG. 4D.

FIG. 2A, FIG. 2B, FIG. 2C, and FIG. 2D show different views ofinterconnections 210 and a base 230, according to some embodimentsdescribed herein. FIG. 2A shows a side view of interconnections 210 andbase 230. FIG. 2B shows a perspective view (with respect to x, y, and zdirections) of a portion of one of interconnections 210 of FIG. 2A. FIG.2C shows a cross section of a portion of interconnections 210 and base230 of FIG. 2A. FIG. 2D shows a top view of a via 234 of base 230 ofFIG. 2C.

Interconnections 210 and base 230 in FIG. 2A through FIG. 2D maycorrespond to interconnections 110 and base 130, respectively, ofFIG. 1. FIG. 2A shows only three interconnections 210 as an example. Thenumber of interconnections 210 may vary.

As shown in FIG. 2A, base 230 may include surfaces (e.g., top and bottomsurfaces) 231 and 232, and an opening 233 extending between surfaces 231and 232 at each of interconnections 210. Base 230 may include a via 234(FIG. 2C and FIG. 2D) associated with opening 233. Via 234 may includean electrically conductive via (e.g., a metal via). At least a portionof via 234 may be located inside (e.g., near surface 231) opening 233.Via 234 may include a sidewall 235 having a cylindrical shape (e.g., acylindrical sidewall 235). Base 230 may include conductive paths (notshown) coupled to via 234 to provide electrical communication (e.g., inthe form of signals) to and from one or more of interconnections 210through via 234. Such electrical communication may include signalscarrying power supply, data information, control information, or otherkinds of information,

Each of interconnections 210 (FIG. 2A, FIG. 2B, and FIG. 2C) may includeelectrical components and mechanical components. The electricalcomponents may include a collar 211 and a pin 215 having conductivematerial (e.g., metal such as copper). The mechanical components mayinclude a spring 260.

As shown in FIG. 2B and FIG. 2C, collar 211 may include portions 212 and213. Portion 212 (FIG. 2B) may have a cylindrical shape that may form aslender cylinder. Portion 212 (FIG. 2C) may be located inside opening233 of base 230 and coupled to via 234. Portion 212 may directly contactsidewall 235 of via 234 and conform to sidewall 235. Portion 212 may beinserted into via 234, such that portion 212 may be coupled to via 234by press fit coupling. Portion 213 (FIG. 2B) may have a ring shape witha dimension (e.g., outer diameter) greater than a diameter of theopening 233. This may allow portion 213 to form a stopper (e.g., amechanical hinder) to prevent collar 211 (e.g., entire collar 211) fromsliding into via 234. Thus, as shown in FIG. 2C, portion 213 may belocated outside via 234 and outside opening 233.

As shown in FIG. 2B, collar 211 may include a slit 214 extending alongthe length (e.g., in the z-direction) of collar 211. Slit 214 mayseparate portion 212 such that portion 212 may not be a continuousportion (e.g., at least part of portion 212 is void of material at slit214). Slit 214 may also separate portion 213 such that portion 213 maynot be a continuous portion (e.g., at least part of portion 213 is voidof material at slit 214). In an alternative structure, collar 211 maynot include a slit (e.g., slit 214) in one or both of portions 212 and213. Thus, in an alternative structure, portion 212 may be a continuousportion, portion 213 may be a continuous portion, or both portions 212and 213 may be continuous portions.

Pin 215 (FIG. 2B and FIG. 2C) includes ends (e.g., pin heads) 216 and217. End 216 (FIG. 2C) may be located outside base 230 (e.g., outsideopening 233 of base 230). End 217 may be located inside base 230 (e.g.,inside opening 233 of base 230). Pin 215 may be electrically coupled(e.g., directly contacting) collar 211. For example, as shown in FIG.2C, a portion between ends 216 and 217 a body) of pin 215 may directlycontact portion 212 of collar 211. Pin 215 may be arranged to move(e.g., slide) in a direction (e.g., z-direction) between ends 216 and217 while maintaining electrical contact with collar 211.

Collar 211, pin 215, and via 234 may establish an electrical connection(e.g., a temporary electrical connection during a test) to allowmonitoring of electrical communication to and from a device (e.g., aDUT, such as device 122 of FIG. 1) coupled to pin 215 of each ofinterconnections 210.

Spring 260 (FIG. 2A) may include a crank-shaped spring. For example,spring 260 may include multiple segments (e.g., three segments as shownin FIG. 2A) that are substantially straight. The multiple segments mayform different angles (e.g., different bends) in spring 260. Spring 260includes ends 261 and 262. End 261 may be coupled (e.g., directlycontacting) to end 217 of pin 215 FIG. 2C). End 262 may be coupled(e.g., fixed) to a fixture 239. Spring 260 may include conductivematerial (e.g., metal). Alternatively, spring 260 may includenon-conductive material (e.g., non-metal material), such that spring 260may not be electrically coupled to pin 215.

Spring 260 may form a mechanical actuator to enable pin 215 to move(e.g., slide) in a direction between ends 216 and 217 when a force isapplied to at least one of ends 216 and 217. For example, spring 260 maybe compressed (e.g., in the z-direction) when an electronic assembly(e.g., electronic assembly 120 of FIG. 1) is attached to pin 215 (e.g.,pressed against pin 215 in the z-direction) of each of interconnections210. Thus, the arrangement of spring 260 and pin 215 may be associatedwith distributed compliant mechanism, providing functions of spring andload transfer.

The arrangement of spring 260, collar 211, and pin 215 may isolatespring 260 from an electrical path formed by pin 215, collar 211, andvia 234. Thus, in comparison with a conventional interconnection havinga spring included in an electrical path between two pin heads (e.g., apogo-pin), each of interconnections 210 may have a shorter electricalpath formed by pin 215, collar 211, and via 234. This may lead to alower profile (e.g., smaller interconnection dimension in thez-direction) for interconnections 210 between base 230 and otherelectronic devices (e.g., between base 230 and electronic assembly 120of FIG. 1). Lower profile may improve device electrical performance,such as signal integrity and power delivery.

Each of interconnections 210 may have a relatively large pin stroke withadequate force to make electrical contact with another device (e.g.,with electronic assembly 120 of FIG. 1). The pin stroke refers adistance that pin 215 may move (e.g., slide) from a reference point toanother point (e.g., move in the z-direction). In some cases, thinnerand smaller device form factor (e.g., in FIG. 1, thinner device 120,substrate 122, or both) may impact negatively to the planarity ofsemiconductor package (e.g., electronic assembly 120 of FIG. 1). In someof such cases, a relatively large pin stroke may be needed to improvethe quality of electrical connections (e.g., connections between base230 and electronic assembly 120 of FIG. 1) that may be compromised whenfactors such as package warpage and manufacturing tolerances arepresent. In a conventional interconnection (e.g., a pogo-pin), it may bedifficult (or unachievable in some cases) to increase pin stroke withoutdecreasing pin force or increasing the length of the pin. However, ifsuch a pin force is decreased in (e.g., in a pogo-pin) in order toincreased pin stroke, electrical contact between the pin and a contactof a device (coupled to the pin) may be degraded (e.g., increased inresistance).

In interconnections 210, however, the arrangement of spring 260 and pin215 may enable a large pin stroke (e.g., in comparison with a pogo-pin)by distributing the stress induced by displacement and load to thedistributed spring mechanism. Thus, in interconnections 210, the pinstroke of pin 215 may be increased without increasing the length of pin125 or decreasing the pin force. This may improve the quality ofelectrical connections between base 230 and other devices (e.g.,electronic assembly 120 of FIG. 1) when package (e.g., substrate 123)warpage, manufacturing tolerances, or other undesirable factors arepresent.

FIG. 3A, FIG, 3B, FIG. 3C, and FIG. 3D show different views ofinterconnections 310 having a rod 370 between a pin 215 and a spring360, and a base 330, according to some embodiments described herein.Interconnections 310 and base 330 in FIG. 3A through FIG. 3D maycorrespond to interconnections 110 and base 130, respectively, ofFIG. 1. FIG. 3A shows only three interconnections 310 as an example. Thenumber of interconnections 310 may vary.

Interconnections 310 and base 330 may include elements similar to oridentical to those of interconnections 210 and base 230 (FIG. 2A throughFIG. 2D), respectively. Thus, for simplicity, similar or identicalelements between interconnections 210 and 310 and between bases 230 and330 are given the same reference numbers. The description of suchsimilar or identical elements is not repeated in the description of FIG.3A through FIG. 3D.

As shown in FIG. 3B and. FIG. 3C, each of interconnections 310 mayinclude electrical components formed by collar 211 and pin 215, andmechanical components formed by spring 360 and rod 370. The arrangementof the spring 360, rod 370, and pin 215 may be associated with lumpedcompliant mechanism. Spring 360 may be coupled to end 217 of pin 215through rod 370, which enables transferring spring load to the pin 215.Rod 370 may include conductive material (e.g., metal). Alternatively,rod 370 may include non-conductive material (e.g., non-metal material),such that spring 360 may not be electrically coupled to pin 215.

Spring 360 (FIG. 3C) may include a coil spring having ends 361 and 362.End 361 may be coupled (e.g., directly contacting) to end 372 of rod370. End 362 may he coupled (e.g., fixed) to base 330 (e.g., positioningon the bottom of base 330). Alternatively, spring 360 may include aplanar spring.

FIG. 3A and FIG. 3C shows only one spring 360 as an example. Multiplesprings may he used. For example, instead of having only one spring 360,two or more springs similar to or identical to spring 360 may bearranged (e.g., stacked) on top of each other inside opening 233.

In comparison with conventional interconnections (e.g., pogo-pins), thearrangement of spring 360, rod 370, and pin 215 may allowinterconnections 310 to have a relatively lower profile and larger pinstroke similar to that of spring 260 and pin 215, as described abovewith reference to FIG. 2A through FIG. 2D.

FIG. 4A, FIG. 4B, FIG. 4C, and FIG. 4D show different views ofinterconnections 410 and a base 430, according to some embodimentsdescribed herein. FIG. 4A shows a side view of interconnections 410 andbase 430. FIG. 4B shows a perspective view (with respect to x, y, and zdirections) of a portion of one of interconnections 410 of FIG. 4A, FIG.4C shows a cross section of a portion of interconnections 410 and base430 of FIG. 4A. FIG. 4D shows a top view of a via 434 of base 430 ofFIG. 4C.

Interconnections 410 and base 430 in FIG. 4A through FIG. 4D maycorrespond to interconnections 110 and base 130, respectively, ofFIG. 1. FIG. 4A shows only three interconnections 410 as an example. Thenumber of interconnections 410 may vary.

Base 430 may include elements similar to or identical to those of base230 (FIG. 2A, FIG. 2C, and FIG. 2D). For example, base 430 may includesurfaces 431 and 432, an opening 433 and a via 434 (having sidewall 435)at each of interconnections 410. Base 430 may include conductive paths(not shown) coupled to via 434 to provide electrical communication toand from one or more of interconnections 410 through via 434.

As shown in FIG. 4A, FIG. 4B, and FIG. 4C, each of interconnection 410may include electrical components and mechanical components. Theelectrical components may include a collar 411 (FIG. 4B) and a pin 415(FIG. 4B and FIG. 4C) having conductive material (e.g., metal such ascopper). The mechanical components may include a volute spring 460 (FIG.4B and 4C) having conductive material. Volute spring 460 may providerelatively large contact areas contacting collar 411 and pin 415 andprovide pin lateral stability.

Collar 411 (FIG. 4B) may include portions 412 and 413 (FIG. 4B and FIG.4C). Portion 412 may have a cylindrical shape that may form a plumpcylinder surrounding at least a portion of volute spring 460. Portion412 (FIG. 4C) may be located inside opening 433 of base 430 and coupledto via 434. Portion 412 may directly contact sidewall 435 (FIG. 4D) ofvia 434 and conform to sidewall 435. Portion 412 may be inserted intovia 434, such that portion 412. may be coupled to via 434 by press fitcoupling. Portion 413 of collar 411 may be located outside opening 433.Portion 413 (FIG. 4B) may have a ring shape with a dimension (e.g.,outer diameter) greater than a diameter of the opening 433. This mayallow portion 413 to form a stopper (e.g., a mechanical hinder) toprevent collar 411 (e.g., entire collar 411) from sliding into via 434.The stopper may also set a reference z-height at the top (e.g., nearsurface 431) of base 430 that may eliminate manufacturing toleranceconcern on the thickness of base 430.

As shown in FIG. 4B, collar 411 may include a slit 414 extending alongthe length (e.g., in the z-direction) of collar 411. Slit 414 mayseparate portion 412 such that portion 412 may not be a continuousportion (e.g., at least part of portion 412 is void of material at slit414). Slit 414 may also separate portion 413 such that portion 413 maynot be a continuous portion (e.g., at least part of portion 413 is voidof material at slit 414). In an alternative structure, collar 411 maynot include a slit (e.g., slit 414) in one or both portions 412 and 413.Thus, in an alternative structure, portion 412 be a continuous portion,portion 413 be a continuous portion, or both portions 412 and 413 may becontinuous portions.

Pin 415 (FIG. 4B and FIG. 4C) includes ends (e.g., pin heads) 416 and417. End 416 may be located outside base 430 (e.g., outside opening 433of base 430). End 417 may be located inside base 430 (e.g., insideopening 433 of base 430). End 417 may include a feature (e.g., a snap-infeature) that may allow pin 415 to be inserted (e.g., snapped) intovolute spring 460 and collar 411. Pin 415 (FIG. 4A and FIG. 4C) may beelectrically coupled (e.g., directly contacting) collar 411. Forexample, as shown in FIG. 4C, the portion between ends 416 and 417(e.g., a body) of pin 415 may directly contact portion 412 of collar411. Pin 415 may be arranged to move (e.g., slide) in a direction (e.g.,z-direction) between ends 416 and 417 while maintaining electricalcontact with volute spring 460 and collar 411.

As shown in FIG. 4B and. FIG. 4C, at least a portion of volute spring460 may surround at least a portion of pin 415 between ends 416 and 417.Portion 412 may hold and surround at least a portion of the volutespring 460 and a portion of pin 415, such that at least a portion ofvolute spring 460 may be between portion 412. of collar 411 and aportion of pin 415.

Collar 411, pin 415, volute spring 460, and via 434 may establish anelectrical connection (e.g., a temporary electrical connection) to allowmonitoring of electrical communication (e.g., in the form of electricalsignals) to and from a device (e.g., a DUT, such as device 122 ofFIG. 1) coupled to pin 415 of each of interconnections 410.

Volute spring 460 may form a mechanical actuator to enable pin 415 tomove (e.g., slide) in a direction between ends 416 and 417 when a forceis applied to at least one of ends 416 and 417. For example, volutespring 460 may be compressed (e.g., in the z-direction) when anelectronic assembly (e.g., electronic assembly 120 of FIG. 1) isattached to pin 415 (e.g., pressed against pin 415 in the z-direction)of each of interconnections 410.

Each of interconnections 410 may have a shorter electrical path (e.g.,formed by pin 415, spring 460, collar 411, and via 434) in comparisonwith a conventional interconnection (e.g., a pogo-pin). This may lead toa lower profile for interconnections 410 between base 430 and otherelectronic devices (e.g., between base 430 and electronic assembly 120of FIG. 1). Each of interconnections 410 may also have a relativelylarge pin stroke in comparison with a conventional interconnection(e.g., a pogo-pin).

The above description and the drawings sufficiently illustrate specificembodiments to enable those skilled in the art to practice them. Otherembodiments may incorporate structural, logical, electrical, process,and other changes. Portions and features of some embodiments may beincluded in, or substituted for, those of other embodiments. Embodimentsset forth in the claims encompass all available equivalents of thoseclaims.

The Abstract is provided to comply with 37 C.F.R. Section 1.72(b)requiring an abstract that will allow the reader to ascertain the natureand gist of the technical disclosure. It is submitted with theunderstanding that it will not be used to limit or interpret the scopeor meaning of the claims. The following claims are hereby incorporatedinto the detailed description, with each claim standing on its own as aseparate embodiment.

1-20. (canceled)
 21. An electronic arrangement comprising: a collarhaving at least a portion located inside an opening in a base; a pinelectrically coupled to the collar, the pin including a first endoutside the base and a second end inside the base; and a spring arrangedto enable the pin to move in a direction between the first and secondends if a force is applied to at least one of the first and second ends,wherein the spring is indirectly coupled to the collar.
 22. Theelectronic arrangement of claim 21, wherein the collar includes aportion having a cylindrical shape, the opening of the base includes avia, and at least part of the portion having the cylindrical shapeconforms to a sidewall of the via.
 23. The electronic arrangement ofclaim 21, wherein the collar includes an additional portion locatedoutside the opening of the base and having a dimension greater than adiameter of the opening of the base.
 24. The electronic arrangement ofclaim 21, wherein the spring includes a coil spring.
 25. The electronicarrangement of claim 21, wherein the spring includes a planar spring.26. The electronic arrangement of claim 21, wherein the spring iscoupled to the second end of the pin through a rod located between thesecond end of the pin and the spring.
 27. The electronic arrangement ofclaim 21, wherein the spring is not electrically coupled to the pin. 28.The electronic arrangement of claim 21 further comprising: an additionalcollar having at least a portion located inside an additional opening inthe base; an additional pin electrically coupled to the additionalcollar, the additional pin including a first end outside the base and asecond end inside the base; and an additional spring arranged to enablethe additional pin to move in a direction between the first and secondends of the additional pin if a force is applied to at least one of thefirst and second ends of the additional pin, wherein the additionalspring is indirectly coupled to the additional collar.
 29. Theelectronic arrangement of claim 21, wherein the base includes a printedcircuit board.
 30. The electronic arrangement of claim 21, wherein thebase includes an interface arranged to be coupled to an analyzer in atest.
 31. The electronic arrangement of claim 30, wherein the pin isarranged to be coupled to an electronic assembly in the test.